Low temperature flexible die attach adhesive and articles using same

Adhesif de fixation sur matrice souple a basse temperature

Abstract

Described is a flexible adhesive formulation for bonding a semiconductor device (14), a flexible substrate and a flexible card containing a semiconductor device (14) which can be processed in a computer.
L'invention se rapporte à une formulation adhésive souple destinée à fixer un dispositif semiconducteur (14) à un substrat souple et à une carte souple contenant un dispositif semiconducteur (14) qui peut être traité dans un ordinateur.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (2)

    Publication numberPublication dateAssigneeTitle
    US-4552690-ANovember 12, 1985Mitsubishi Gas Chemical Company, Inc.Electrically conductive resin composition
    US-5150195-ASeptember 22, 1992Johnson Matthey Inc.Rapid-curing adhesive formulation for semiconductor devices

NO-Patent Citations (0)

    Title

Cited By (2)

    Publication numberPublication dateAssigneeTitle
    US-5489637-AFebruary 06, 1996Johnson Matthey IncLow temperature flexible die attach adhesive and articles using same
    US-5612403-AMarch 18, 1997Johnson Matthey, Inc.Low temperature flexible die attach adhesive and articles using same